S310N

1. IPC control equipment operation, simplifying The use of automated equipment.
2. Electromagnetic suction design for The feed to provide a simple operation, stable and reliable operation of The system;
3. Vacuum leakage test;
4. Solid crystal position precision and excellent consistency for The process after The provision of innate protection, while The solid crystal position to ensure accurate LED light spot quality, good welding and beautiful spot coupled with excellent chip to form a high-quality LED products ;
5. Direct drive motor drive head;
6. Use a linear motor to drive The wafer search (X / Y) platform and feed B / C) platform
7. The use of new Thermostatic dispensing system;

1. The system function

• Production cycle: 200ms (depending on chip size and bracket)
• XY: ± 1.5 mil (± 0.038 mm)

• Chip size: 10mil * 10mil-100mil * 100mil
• (0.15 mm * 0.15 mm - 2.5 mm * 2.5 mm)
• Maximum chip ring size: 8 '(212mm) OD
• Maximum chip area size: 6 '(152mm) after expansion
• Maximum travel: 8 '* 8' (170mm * 170mm)
• Resolution: 0.04mil (1μm)
• Repetition rate: 0.08 mil (2 [mu] m)
• Thimble Z height travel: 80mil (2mm)

3. Image recognition system

• Image recognition: 256 levels of gray
• Resolution: 512 * 512 pixels
• Image recognition accuracy: ± 0.025mil@50mil observation range

• Suction arm: 90 ° rotatable welding
• Crystal pressure: adjustable 40g-250g

• XY resolution: 1μm
• Adaptation bracket length: 150 ~ 180mm
• Adaptation bracket width: 28 ~ 65mm

• Voltage: 220V AC
• Frequency: 50HZ
• Compressed air: 5kg / cm² (MIN)
• Air consumption: 5L / min
• Rated power: 700W
• Starting power: 1300W

• Length * width * height: 120 * 950 * 180cm
• Weight: 700kg