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GS Automation (M) Sdn Bhd
Johor (HQ)
27, Jalan Bayu 2/5,
Taman Perindustrian
Tampoi Jaya,
81200 Johor Bahru,
Johor, Malaysia
+6019-772 0513
Melaka Branch
35-1, Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka, Malaysia.
+6012-776 1899
+606-234 4255
Penang Branch
No. 1-5-28, Lebuh Bukit Kecil 6,
MK 12, 11900 Bayan Lepas,
Pulau Pinang, Malaysia.
+6012-738 3111
GS Automation Technology Pte Ltd
11, Woodlands Close,
#07-25 Woodlands 11,
Singapore (737853)
+65-9380 4896
+65-8206 1018
sales@gs-tech.com.sg+65-8206 1018
GS Automation (Thailand) Co.,Ltd.
48/211, Moo 5,
Latsawai Lamlukka District,
Pathumthani, 12150,
Bangkok, Thailand.
GS100BH-N
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GS100BH
Flat High-speed Solid Crystal Machine (Period: 60ms)Applicable to SMD020,1010,2121,3014 and 2835,5050 and so on
The model characteristics
- The use of the world's leading dual solid crystal, double dispensing, dual-chip search system;
- Direct drive motor drive head
- Using the linear motor drive to search the wafer platform (X / Y) and the feed platform (B / C)
- The use of new thermostatic dispensing system;
- Vacuum leakage test;
- The use of automatic loading and unloading effectively improve the production efficiency;
- Industrial computer control equipment operation, simplifies the use of automated equipment;
- Precise automation equipment for enterprises to improve production efficiency and reduce costs to provide an effective guarantee, so as to effectively improve the competitiveness of enterprises;
- Solid crystal position precision and excellent consistency for the post-process to provide a guarantee of innate, while the solid crystal position to ensure accurate LED light spot quality, good welding and beautiful light coupled with excellent chip to form a high-quality LED products ;
The specification parameters
| 1. System function | 4. Suction crystal arm arm robot system | ||
| Production cycle | 60ms (depending on chip size and bracket) | Crystal arm | 90 ° rotatable solid crystal |
| XY | ± 1.5mil (± 0.038mm) | Crystal pressure | Adjustable 40g-250g |
| Chip rotation | ±3° | 5. Feeding work platform | |
| 2. Chip XY table | Travel range | 6.30 'x 2.95' (170mm * 75mm) | |
| Chip size | 5mil × 5mil-100mil × 100mil (0.13mm * 0.13mm-2.54mm * 2.54mm) | XY resolution | 0.02 mil (0.5 m) |
| 6. Applicable bracket size | |||
| Chip maximum angle correction | ± 15 ° (optional) | Bracket length | 120 ~ 170mm |
| Maximum chip ring size | 6 '(152mm) OD | Bracket width | 30~ 75mm |
| Maximum chip area size | 4.7 '(119mm) after expansion | 7. Facilities required | |
| Maximum stroke | 8 'x 8' (203 mm * 203 mm) | Voltage frequency | 220V AC±5%/50HZ |
| Resolution | 0.04 mil (1 m) | Compressed air | 5kg / cm² (MIN) |
| Repetition rate | 0.8mil (2mm) | rated power | 750W |
| Thimble Z height travel | 80mil (2mm) | Start power | 1300W |
| 3. Image recognition system | Air consumption | 5L/min | |
| Image Identification | 256 grayscale | 8. Volume and weight | |
| Resolution | 656 × 492 pixels | Long x wide x high | 150×100×180cm |
| Image recognition accuracy | ±0.025mil@50mil observation range | weight | 800kg |