GS Automation Technology Pte. Ltd.
GS Automation (M) Sdn Bhd

Johor (HQ)

No. 27, Jalan Bayu 2/5, Kawasan Perindustrian Tampoi Jaya, 81200 Johor Bahru, Johor, Malaysia.
  +6019-772 0513

Melaka Branch
35-1, Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka, Malaysia.
+6012-776 1899
+606-234 4255

Penang Branch
No. 1-5-28, Lebuh Bukit Kecil 6,
MK 12, 11900 Bayan Lepas,
Pulau Pinang, Malaysia.
+6012-738 3111

GS Automation Technology Pte Ltd
11, Woodlands Close,
#07-25 Woodlands 11,
Singapore (737853)
+65-9380 4896
+65-8206 1018

GS Automation (Thailand) Co.,Ltd.
48/211, Moo 5,
Latsawai Lamlukka District,
Pathumthani, 12150,
Bangkok, Thailand.

HANS-5201S SMD Wire Bonder

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HANS-5201S SMD Wire Bonder Wire Bonder Hans SMT Equipments and Machinery

HANS-5201S SMD Wire Bonder

Bonding Cycle: 53ms/wire

Applicable to IC: SOT, SOP, SSOP, TSSOP, SOIC, QFP, DIP, BGA, COB, Opto-coupler etc.

Applicable to LED: 010, 020, 0201, 0402, 0603, 0805, 1206, 2835, 3014, 3020, 3528, 5050, 5630, 5730, COB, High-power etc.

Applicable to variable wire materials: gold/alloy/copper wire

Product advantages:

  • New generation high speed and high precision bonder electromechanical system, for higher UPH
  • World leading high speed and high precision XY electromechanical system
  • Continuous zoom optical lens
  • Two colors LED lighting, supporting side lighting
  • Material handling system with various materials
  • Supporting ahead recognition and other patterns, getting better recognition effect and speed with different materials
  • Friendly Windows UI, innovative online video help function
  • Chinese-English operation interface can be changed easily, without ON &OFF
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