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- Precision Molded Replaceable Rubber Tips
- SMT Equipments and Machinery
- Customize Factory Automation and Industrial 4.0 Solution
- 3D AOI
- 3D SPI
GS Automation Technology Pte. Ltd.
GS Automation (M) Sdn Bhd
Johor (HQ)
No. 27, Jalan Bayu 2/5, Kawasan Perindustrian Tampoi Jaya, 81200 Johor Bahru, Johor, Malaysia.
+6019-772 0513
Melaka Branch
35-1, Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka, Malaysia.
+6012-776 1899
+606-234 4255
Penang Branch
No. 1-5-28, Lebuh Bukit Kecil 6,
MK 12, 11900 Bayan Lepas,
Pulau Pinang, Malaysia.
+6012-738 3111
GS Automation Technology Pte Ltd
11, Woodlands Close,
#07-25 Woodlands 11,
Singapore (737853)
+65-9380 4896
+65-8206 1018
sales@gs-tech.com.sg+65-8206 1018
GS Automation (Thailand) Co.,Ltd.
48/211, Moo 5,
Latsawai Lamlukka District,
Pathumthani, 12150,
Bangkok, Thailand.
HANS-5201S SMD Wire Bonder
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HANS-5201S SMD Wire Bonder
Bonding Cycle: 53ms/wire
Applicable to IC: SOT, SOP, SSOP, TSSOP, SOIC, QFP, DIP, BGA, COB, Opto-coupler etc.
Applicable to LED: 010, 020, 0201, 0402, 0603, 0805, 1206, 2835, 3014, 3020, 3528, 5050, 5630, 5730, COB, High-power etc.
Applicable to variable wire materials: gold/alloy/copper wire
Product advantages:
- New generation high speed and high precision bonder electromechanical system, for higher UPH
- World leading high speed and high precision XY electromechanical system
- Continuous zoom optical lens
- Two colors LED lighting, supporting side lighting
- Material handling system with various materials
- Supporting ahead recognition and other patterns, getting better recognition effect and speed with different materials
- Friendly Windows UI, innovative online video help function
- Chinese-English operation interface can be changed easily, without ON &OFF