GS Automation Technology Pte. Ltd.
GS Automation (M) Sdn Bhd

Johor (HQ)

No. 27, Jalan Bayu 2/5, Kawasan Perindustrian Tampoi Jaya, 81200 Johor Bahru, Johor, Malaysia.
  +6019-772 0513

Melaka Branch
35-1, Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka, Malaysia.
+6012-776 1899
+606-234 4255

Penang Branch
No. 1-5-28, Lebuh Bukit Kecil 6,
MK 12, 11900 Bayan Lepas,
Pulau Pinang, Malaysia.
+6012-738 3111

GS Automation Technology Pte Ltd
11, Woodlands Close,
#07-25 Woodlands 11,
Singapore (737853)
+65-9380 4896
+65-8206 1018

GS Automation (Thailand) Co.,Ltd.
48/211, Moo 5,
Latsawai Lamlukka District,
Pathumthani, 12150,
Bangkok, Thailand.

HAN-3291 TRAY-BOXDie Bonder

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HAN-3291 TRAY-BOXDie Bonder Wire Bonder Hans SMT Equipments and Machinery

HAN-3291 TRAY-BOX Die bonder

High speed: UPH 16K 220ms/cycle

Dedicate to die picking function from wafer to TRAY-box(bonding without epoxy)

Suitable for various products: such as SMD LED, display LED, lamp LED, smart card IC, COB, power LED etc.

High precision 1.5 mil3°

Product advantages:

1. Extra-large and flexible work table

  • Extra-large material work table,5.5× 8double-groove(Maximum 5.5x16)
  • Only 10 minutes changing time for different device
  • Smart general jig design for diverse material requirement
  • Automatic fixture locking setup

2. Twin vision systems for wafer and bonding for higher die bonding precision

3. Single monitors and operation modes for real time operation status monitor and easier operation

4. Advanced die picking system

  • Pressure Sensing for die picking detection, prevent from missing die
  • Breakage wafer protection to ensure production quality
  • Programmable die searching area, die position and ejector settings
  • Options of 4×6”wafer ring or 1×8”wafer ring
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